Encyclopedia knowledge on the use of epoxy resin electronic potting adhesive
Electronic sealing adhesive is generally composed of component A, which is the epoxy resin component, and component B, which is the curing agent component. Its curing reaction is mainly a chemical reaction between the epoxy group in the epoxy resin and the active groups of the curing agent, resulting in a highly stable three-dimensional network structure that is neither melting nor melting.
& nbsp; & nbsp; & nbsp; When using epoxy resin sealant, users often encounter this problem, causing inconvenience and losses to users& nbsp; Before discussing this issue, let's first understand several forms of so-called non solidification:< br />
& nbsp; & nbsp; & nbsp; 1. Completely liquid, the mixed infusion of glue only shows slight signs of thickening< br />
& nbsp; & nbsp; & nbsp; 2. The adhesive after sealing becomes sticky to the hands or forms a mud like state< br />
& nbsp; & nbsp; & nbsp; 3. The same sealed product may have solidified in some areas and remain liquid in others< br />
& nbsp; & nbsp; & nbsp; 4. There are many products in the same batch that are sealed, some of which are completely cured, while others are uncured or incompletely cured< br />
& nbsp; & nbsp; & nbsp; 5. It has always been in a basic cured state and cannot achieve the desired curing hardness; Wait a bit, there may be other non curing situations during use, and here are just a few common manifestations< br />
& nbsp; & nbsp; & nbsp; Next, we need to understand the curing mechanism of epoxy resin electronic sealant:< br />
& nbsp; & nbsp; & nbsp; Electronic sealing adhesive is generally composed of component A, which is the epoxy resin component, and component B, which is the curing agent component. Its curing reaction is mainly a chemical reaction between the epoxy group in the epoxy resin and the active groups of the curing agent, resulting in a highly stable three-dimensional network structure that is neither melting nor melting. Normally, as long as epoxy resin is mixed with epoxy curing agent, a curing chemical reaction will occur, which is irreversible< br />
& nbsp; & nbsp; & nbsp; Based on the above understanding, let's take a look at why poor solidification occurs during the homework process< br />
& nbsp; & nbsp; & nbsp; The main reason is that the epoxy resin components and curing agent components have not undergone effective chemical reactions or the reactions are insufficient! One component participating in a chemical reaction is insufficient to react with another component; Simply put, for example: after the curing agent has reacted, there is still a large amount of residual epoxy resin that has not participated in the chemical reaction, or vice versa; We summarize the following situations that can cause insufficient response:< br />
& nbsp; & nbsp; 1. Mixing ratio: The mixing ratio was not carried out according to the supplier's requirements. Most manufacturers require a weight ratio for mixing, but sometimes users may choose to use a volume ratio for convenience or electronic weighing tools may not have significant errors< br />
& nbsp; & nbsp; 2. Mixing: Insufficient mixing was carried out, resulting in insufficient and effective uniform mixing of epoxy resin and curing agent components; Another common issue with this type of container is that the operator only keeps stirring at the center point while ignoring the bottom and edges of the container walls, which can easily result in some solidification and some non solidification< br />
& nbsp; & nbsp; 3. Tools: Many workers use irregular or circular manual mixing tools for convenience. These types of tools are difficult to mix evenly, and mixing equipment is generally recommended. If the amount is small, it is recommended to use thinner rectangular tools for manual mixing< br />
& nbsp; & nbsp; 4. Pollution: Generally, epoxy resin curing agents are mostly amines, which are weakly alkaline. If some acidic substances are mixed in during use, it is easy to neutralize and react with the curing agent, resulting in poor curing< br />
& nbsp; & nbsp; 5. Storage: The A component of epoxy resin sealant generally contains some functional powder fillers, which have a higher density than the resin. When stored for too long, it is easy to precipitate and separate, which is also a problem that users often overlook. Therefore, before using electronic sealant, it is usually recommended to thoroughly stir the entire barrel of A component before weighing and proportioning it with the curing agent component; Otherwise, incomplete solidification may occur.