& nbsp; & nbsp; Epoxy resin sealant



  & nbsp; & nbsp; Epoxy resin sealant is mostly hard, and after curing, it is almost as hard as stone, making it difficult to remove. It has good confidentiality function, but there are also a few parts that are soft. The normal temperature resistance is around 100 ℃, the temperature resistance for heating curing is around 150 ℃, and there are also temperatures above 300 ℃. It has characteristics such as fixation, insulation, waterproofing, oil resistance, dust resistance, anti-theft, corrosion resistance, aging resistance, and resistance to thermal shock. Common types of epoxy sealant include flame retardant, thermal conductive, low viscosity, high temperature resistant, etc< br />


  & nbsp; & nbsp; Features: Good adhesion to hard materials, excellent high temperature resistance and electrical insulation ability, simple operation, very stable before and after curing, excellent adhesion to various metal substrates and porous substrates< br />


  & nbsp; & nbsp; Scope of application: Epoxy resin sealant is easy to penetrate into the gaps of products, suitable for sealing small and medium-sized electronic components at room temperature without special requirements for environmental mechanical properties, such as car and motorcycle igniters, LED driver power supplies, sensors, ring transformers, capacitors, triggers, LED waterproof lights, circuit boards for confidentiality, insulation, and moisture (water) sealing.
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  & nbsp; & nbsp; Organic silicone sealant

 
  & nbsp; & nbsp; After curing, organic silicon electronic sealant is mostly soft and elastic, which can be repaired, abbreviated as soft glue, with poor adhesion. Its color can generally be adjusted as needed, whether it is transparent, non transparent, or colored. Two component silicone sealant is the most common, which includes two types: condensation type and additive type. Generally, condensation type has poor adhesion to components and encapsulation cavities, and volatile low molecular substances are produced during the curing process, resulting in a significant shrinkage rate after curing; The addition molding (also known as silicon gel) has very small shrinkage rate, and will not produce volatile low molecular substances during the curing process, which can be heated for rapid curing< br />
 
  & nbsp; & nbsp; Advantages: strong aging resistance, good weather resistance, excellent impact resistance; It has excellent resistance to thermal changes and thermal conductivity, and can be used in a wide range of working temperatures. It can maintain elasticity within the temperature range of -60 ℃ to 200 ℃ without cracking, and can be used for a long time at 250 ℃. The heating curing type has higher temperature resistance and excellent electrical and insulation properties. Its insulation performance is better than epoxy resin, and it can withstand voltage of over 10000V. After encapsulation, it effectively improves the insulation between internal components and circuits, and enhances the stability of electronic components; Has no corrosiveness to electronic components and does not produce any by-products during the curing reaction; Has excellent repair capabilities, can quickly and conveniently remove sealed components for repair and replacement; Has excellent thermal conductivity and flame retardancy, effectively improving the heat dissipation capacity and safety factor of electronic components; Low viscosity, good fluidity, able to penetrate into small gaps and under components; Can be cured at room temperature or by heating, with good self foaming properties and more convenient use; The curing shrinkage rate is small, and it has excellent waterproof performance and seismic resistance< br />
 
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  & nbsp; & nbsp; 1: Long term protection for sensitive circuits or electronic components, and effective protection for electronic modules and devices, whether simple or complex in structure and shape< br />
 
  & nbsp; & nbsp; 2: Having stable dielectric insulation properties, it is an effective barrier to prevent environmental pollution. After curing, it forms a soft elastic body that eliminates stress caused by impact and vibration in a large temperature and humidity range< br />
 
  & nbsp; & nbsp; 3: It can maintain its original physical and electrical properties in various working environments, resist degradation by ozone and ultraviolet radiation, and has good chemical stability< br />


  & nbsp; & nbsp; 4: After sealing, it is easy to clean and remove for repairing electronic components, and new sealing glue can be injected into the repaired area< br />


  & nbsp; & nbsp; Scope of application: Suitable for encapsulating various electronic components that work in harsh environments.
 
  & nbsp; & nbsp; Polyurethane sealant
  & nbsp; & nbsp; Polyurethane potting adhesive, also known as PU potting adhesive, is mostly soft and elastic after curing and can be repaired. It is referred to as soft adhesive, with bonding properties between epoxy and silicone, average temperature resistance, generally not exceeding 100 ℃. After potting, there are many bubbles, and the potting conditions must be under vacuum, with bonding properties between epoxy and silicone.
  & nbsp; & nbsp; Advantages: Good low-temperature resistance and the best shock resistance among the three. It has the characteristics of low hardness, moderate strength, good elasticity, water resistance, mold resistance, shock resistance, and transparency. It has excellent electrical insulation and flame retardancy, no corrosion to electrical components, and good adhesion to metals such as steel, aluminum, copper, tin, as well as materials such as rubber, plastic, and wood< br />
 
  & nbsp; & nbsp; Scope of application: Suitable for encapsulating indoor electrical components with low heat generation, it can protect installed and debugged electronic components and circuits from vibration, corrosion, moisture, dust, etc. It is an ideal encapsulation material for moisture-proof and anti-corrosion treatment of electronic and electrical components.