& nbsp; & nbsp; Industrial adhesives belong to the fine chemical industry, but they are widely used and almost ubiquitous. Moreover, there are many types and brands of adhesives, and even a single supplier can have hundreds of products. In addition, the selection of adhesive requires professional knowledge and background, which involves many aspects such as materials, chemical engineering, surface treatment, electrochemistry, structural design, and technology, which can affect production efficiency, yield, cost, as well as product functionality and quality. Moreover, the correct use of glue is closely related to the production process and is a multidisciplinary task; Finally, there are strict regulations and requirements for the transportation and storage of glue< br />


  & nbsp; & nbsp; The most basic function of bonding is to connect. But in modern manufacturing, with the development of technology, people's requirements for the performance of glue, their expectations for the role of glue, and their expectations for the application and adaptability of glue are all increasing.
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  & nbsp; & nbsp; The role of industrial adhesives in manufacturing

  & nbsp; & nbsp; Mechanical and physical connections are the most basic functions of glue. It can be considered from two aspects: one is to bear loads and transmit external forces; Here, the main function of glue is to tightly fix two components together and transmit external force from one component to another, such as the blade and core of a chainsaw, which are bonded together by glue and transmit the force (torque) during the operation of the chainsaw to the blade. In addition, the connection between the motor rotor and the shaft follows the same principle. Generally speaking, for adhesives that can withstand loads, they should have extremely high bonding strength and good impact resistance, as well as good adhesive processability and rapid curing characteristics< br />


  & nbsp; & nbsp; For adhesives that serve as physical connections, industrial adhesives are mainly used during the product assembly process to assemble parts or components of different materials, especially those with relatively small sizes, which are often difficult or impossible to assemble using other mechanical connection methods. Therefore, industrial adhesives are used for assembly. This type of glue often requires good dispensing control, which can achieve precise adhesive application, fast curing speed, and high reliability after bonding< br />


  & nbsp; & nbsp; The protective function is another important role of glue besides its connecting function. With the improvement of people's living standards, electronic products, especially consumer electronics, are playing an increasingly indispensable role in our daily lives. There are a large number of electronic components in electronic products, which are assembled in different ways on PCB boards or FPCB boards. With the increasing miniaturization and lightweighting of product design, electronic components are also becoming more integrated, and circuits are becoming more compact, resulting in smaller gaps between components and pin spacing of the components themselves< br />


  & nbsp; & nbsp; At the same time, these components are often exposed to harsh environments, such as very humid bathrooms or special occasions with high dust, and even people hope to use their phones to take photos or listen to music while swimming. All these changes and requirements require that the entire circuit board or most components must be protected from short circuits, corrosion, or external pressure that may cause failure in harsh environments! Glue plays an indispensable role in this protection, such as the commonly used three proof glue and corner bonding glue, as well as the encapsulation glue for smart cards. Generally speaking, the requirements for this type of adhesive are fast curing speed, low corrosive ion content, high adhesion strength to different materials, and strong resistance to external forces.
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  & nbsp; & nbsp; The multiple functions of glue are one of the important signs of progress in the glue industry, such as achieving physical connection while also playing a role in conductivity. Here, it also includes conductive materials that replace soldering functions and conductive materials that achieve grounding functions. Soldering is a traditional way of connecting wires to achieve conductivity, but its drawback is that the solder joints are often large and occupy a high space, which limits its use as electronic components become increasingly thin and lightweight. In addition, its connection relies on high-temperature melting, so the product has a process of withstanding high temperatures. For components or products that cannot withstand high temperatures, it cannot be realized. For this reason, conductive adhesive can replace solder, overcoming its shortcomings and achieving dual functions of connection and conductivity< br />


  & nbsp; & nbsp; Of course, conductive adhesives can be divided into heating curing, room temperature curing, and even the UV curing type introduced by Panacol based on their curing methods. Even if heated and cured, the curing temperature of conductive adhesive generally does not exceed 150 degrees. In recent years, low-temperature curing conductive adhesives have even appeared on the market, with heating temperatures not exceeding 80 degrees, which will make the application of conductive adhesives more widespread. Generally speaking, for conductive adhesives with grounding functions, high adhesion strength and fast curing speed are often required, as their conductive particle content is not high, resulting in lower costs. The cost is currently an important factor limiting the promotion of conductive adhesives that require conductivity. How to develop conductive adhesives with low resistivity, low cost, and high adhesive strength is the direction that various suppliers are striving for< br />


  & nbsp; & nbsp; The continuous high integration, miniaturization, multifunctionality, and high power of electronic products have made energy and heat management an increasingly prominent issue! These highly integrated components not only need to be securely assembled on the PCB boardAnd the heat generated by its work needs to be quickly dissipated; Sometimes, in order to cool down, an additional heat sink needs to be installed on the surface of the component. In this case, thermal conductive adhesive is the best choice< br />


  & nbsp; & nbsp; The thermal conductivity of glue can be understood from two different aspects: dissipating heat and absorbing heat. For example, glue used to bond heat sinks should be able to quickly dissipate heat; The thermal conductive adhesive that protects the NTC temperature sensor should quickly absorb the heat and transfer it to the chip. These are actually two aspects of the same problem, therefore, the biggest problem with thermal conductive adhesives is the contradiction between the constant pursuit of high thermal conductivity and adhesive strength; Another factor is the influence of thermal conductive particle materials added to achieve thermal conductivity on the glue application process and the rheological properties of the adhesive.
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  & nbsp; & nbsp; There are various failure modes of electronic products, one of which is due to significant external forces that cause the components to detach from the motherboard or the PIN pins to crack, resulting in the inability to function properly. For example, when the FPC is bent and connected to the motherboard, there is a long-term peeling force due to the elasticity of the FPC. Under the long-term effect of this peeling force, the conductive ACF that achieves the connection will produce adhesive cracking. For example, a large capacitor may experience a significant instantaneous impact force during the drop process, causing the PIN pin to crack. For this reason, reinforcement should be carried out on the parts that may cause failure. The simplest and most effective way is to use glue for reinforcement, including FPC reinforcement, reinforcement of large electronic devices such as capacitors, and corner bonding of large chips. This type of adhesive generally requires a fast curing speed, good thixotropy, high bonding strength, and good impact and vibration resistance< br />


  & nbsp; & nbsp; With the continuous widespread and in-depth use of industrial adhesives in various industries, their functions are becoming increasingly diversified, and different industries have their own demand characteristics, showing obvious special functions related to industry or product performance. These special functions have put forward new demands for adhesives. In the optical and communication industries, it is required that the adhesive has a very low shrinkage rate, good resistance to yellowing, and a certain level of light transmittance in a specific wavelength band; For example, some products related to acoustics also hope that the glue has certain noise reduction and acoustic optimization functions; Some industries also crave UV glue that can withstand temperatures of 150 or 180 degrees Celsius for a long time< br />


  & nbsp; & nbsp; From the above analysis, it can be seen that glue, as the most traditional connection method, is playing an increasingly diversified and multifunctional role in modern manufacturing. This trend has injected unlimited vitality and life into the adhesive industryAt the same time, it also presents a completely new challenge!