& nbsp; & nbsp; There are three types of commonly used PCB circuit board sealant, namely polyurethane sealant, epoxy resin sealant, and silicone sealant. How to choose sealing adhesive in the process of preparing PCB board? Below, we will analyze the characteristics of three types of sealing adhesive in detail& nbsp;
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  & nbsp; & nbsp; Polyurethane sealant

  & nbsp; & nbsp; The temperature requirement is not to exceed 100 degrees Celsius, and there are relatively many bubbles after sealing. The sealing conditions are under vacuum, and the adhesion is between epoxy and silicone< br />
  & nbsp; & nbsp; Features: Excellent low-temperature performance and shock resistance< br />
  & nbsp; & nbsp; Scope of application: Suitable for encapsulating indoor electrical components with low heat generation.
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  & nbsp; & nbsp; Epoxy resin sealant

  & nbsp; & nbsp; Features: It has high temperature resistance and electrical insulation ability, simple operation, very stable before and after curing, and excellent adhesion to various metal substrates and porous substrates< br />
  & nbsp; & nbsp; Scope of application: Suitable for encapsulating electronic components at room temperature without special requirements for environmental mechanical properties.
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  & nbsp; & nbsp; Organic silicone sealant

  & nbsp; & nbsp; Advantages: strong aging resistance, good weather resistance, excellent impact resistance; Has excellent resistance to cold and hot changes, can be used in a wide range of working temperatures, and can maintain elasticity within a temperature range of -60 ℃ to 200 ℃ without cracking; Has excellent electrical performance and insulation ability, effectively improves the insulation between internal components and circuits after encapsulation, and enhances the stability of electronic components; Has no corrosiveness to electronic components and does not produce any by-products during the curing reaction; Has excellent repair capabilities, can quickly and conveniently remove sealed components for repair and replacement; Has excellent thermal conductivity and flame retardancy, effectively improving the heat dissipation capacity and safety factor of electronic components; Low viscosity, good fluidity, able to penetrate into small gaps and under components; Can be cured at room temperature or by heating, with good self foaming properties and more convenient use; The curing shrinkage rate is small, and it has excellent waterproof performance and seismic resistance< br />
  & nbsp; & nbsp; Scope of application: Suitable for encapsulating various electronic components that work in harsh environments< br />


  & nbsp; & nbsp; Among the numerous PCB electronic potting adhesives, each has its own characteristics. How to choose the electronic potting adhesive you need. Of course, it is necessary to first clarify the characteristics and requirements of one's own product, and purchase suitable products according to the requirements of one's own process.